Our solutions optimize signal integrity across optical and copper data paths, supporting reliable communication between GPUs, switches, and servers.
Founded in 2016 by industry veterans, the company was created to address the rapidly growing bandwidth demands of modern data center infrastructure. As AI systems scale, Litrinium’s technologies enable next-generation interconnects that deliver higher bandwidth, lower latency, and improved power efficiency.
At the heart of Litrinium’s innovation is an analog design philosophy that blends art and science. We believe the most elegant solutions to today’s toughest connectivity challenges come from the mastery of high-speed analog engineering. Drawing on decades of experience, our team designs advanced analog and mixed-signal architectures that deliver exceptional signal integrity as data rates rise and channel conditions become more demanding. This approach enables reliable, power-efficient communication across the optical and copper links that power modern AI and hyperscale data centers.
Litrinium’s leadership team brings decades of experience developing high-speed analog and optical technologies that power the world’s most demanding data center networks. Across multiple generations of connectivity platforms, the team has tackled the industry’s toughest signal integrity challenges at ever-increasing data rates. Today, they are building one of the industry’s premier analog and mixed-signal engineering organizations, focused on enabling the next generation of AI infrastructure.
Founder, President and Chief Executive Officer
Najabat (Hasnain) Bajwa brings 25 years of experience building successful semiconductor businesses, with particular expertise in high-speed networking. He has a proven track record of driving strategies that achieve market leadership and high growth. Mr. Bajwa is driving Litrinium’s strategic vision to redefine optical connectivity for AI-powered data centers by assembling and leading a world-class team of innovators focused on next-generation signal integrity solutions.
Prior to founding Litrinium, Mr. Bajwa was an executive officer at MACOM (NASDAQ: MTSI) and Mindspeed Technologies. As Senior Vice President and General Manager of the High Performance Analog (HPA) business unit, Mr. Bajwa led HPA to become the largest and most profitable business within Mindspeed, culminating in its successful sale to MACOM in December 2013.
Previously, Mr. Bajwa held positions of increasing responsibility with Hewlett-Packard and Agilent Technologies, including an expatriate assignment to Penang, Malaysia. Mr. Bajwa holds an MBA from UCLA, an MBA from the National University of Singapore, and a Bachelor of Science in Electrical Engineering from Arizona State University. He holds two U.S. patents.
CTO and Senior Vice President of Engineering
Vice President of Marketing
Angus Lai joined Litrinium in 2018 and brings over 20 years of technical marketing and application engineering experience, with particular expertise in optical interconnectivity. Mr. Lai spearheads global marketing strategy to position Litrinium’s breakthrough optical connectivity solutions at the forefront of the AI data center revolution.
Prior to joining Litrinium, Mr. Lai served as Senior Product Marketing Director at MACOM (NASDAQ: MTSI) and Director of Marketing at Mindspeed for the High Performance Analog (HPA) business unit. As head of segment marketing for HPA, Mr. Lai led strategic initiatives that enabled MACOM and Mindspeed to achieve number one market positions in several fiber-to-the-home and data center optical interconnect sectors.
Previously, Mr. Lai held roles with increasing responsibility at Vitesse Semiconductor and Xponent Photonics. Mr. Lai holds a Bachelor of Science in Electrical Engineering from California State University, Northridge (CSUN).
Vice President of Sales
Yasuyuki Tanaka joined Litrinium in 2020 and brings 25 years of sales management experience, with a strong track record in high-performance analog component sales. Mr. Tanaka drives global sales initiatives to expand adoption of Litrinium’s next-generation optical interconnect solutions across AI data center OEMs and partners worldwide.
Prior to joining Litrinium, Mr. Tanaka served in senior executive roles including Country Manager at high-performance embedded computing solutions provider Congatec A.G., Country Manager at MACOM (NASDAQ: MTSI), and Vice President of Sales at Mindspeed Technologies.
Earlier in his career, he held roles with increasing responsibility at Conexant Systems, Rockwell International, and Nippon Avionics. During his career, Mr. Tanaka has spearheaded initiatives that resulted in rapid revenue growth, record sales performance, and number one market share positions in high-growth sectors such as fiber-to-the-home and network processing. Mr. Tanaka holds a Master of Business Administration (MBA) from the University of Chicago Booth School of Business.
Vice President of Operations
Raymond Darcy joined Litrinium in 2025, bringing 25 years of experience in semiconductor operations with expertise in global operations, manufacturing, supply chain, business process engineering, and vendor management. Mr. Darcy oversees global operations and supply chain initiatives to ensure seamless delivery of Litrinium’s optical connectivity technologies for hyperscale AI data centers.
Prior to joining Litrinium, Mr. Darcy held senior executive roles including Vice President of Global Supply Chain at Semtech, Head of Supply Chain at Millennium Space Systems, and Director of Operations at Jazz Semiconductor, which was later acquired by Tower Semiconductor.
Throughout his career, he has implemented processes that drive operational excellence and resilience across functions, geographic regions, and industries. Mr. Darcy has also played an integral role in several successful M&A transactions. Mr. Darcy holds a Bachelor of Engineering in Electronic and Electrical Engineering from the University of the West of Scotland.
Vice President of Quality
Tom McKnelly joined Litrinium in 2021 and brings 30 years of experience in semiconductor operations, with expertise in quality and business systems development and implementation. Mr. McKnelly leads quality and compliance efforts to uphold the highest standards for Litrinium’s optical connectivity components powering the demanding performance requirements of AI data centers.
Prior to joining Litrinium, Mr. McKnelly served in senior executive roles including General Manager for Thin Film Products at Johanson Technologies, Director of Strategic Programs at Semtech Corporation, and Director of Operations and Systems at Atomera. Earlier in his career, Mr. McKnelly held roles with increasing responsibility at Vitesse Semiconductor, Therma-Wave, and Superconductor Technologies.
During his career, he has overseen the development, implementation, and improvement of quality systems, manufacturing processes, and product development programs for numerous products. Mr. McKnelly holds a Bachelor of Science in Materials Science from the University of California, Berkeley and a certificate from the Executive Program at the UCLA Anderson School of Management.
Litrinium develops semiconductor technologies that enable the high-speed connectivity powering modern AI and hyperscale data center infrastructure. Our solutions support optical and copper interconnects that move massive volumes of data between GPUs, switches, and servers inside today’s most advanced computing systems.
As AI systems scale, the volume of data moving across data center networks grows dramatically. Maintaining reliable signal transmission at ever-increasing speeds is one of the most difficult challenges in modern infrastructure.
Litrinium develops technologies that preserve signal integrity across high-speed links, enabling the bandwidth, efficiency, and reliability required by large-scale AI systems.
Litrinium technologies are deployed within the connectivity infrastructure of AI and hyperscale data centers. Our solutions support the optical modules and high-speed copper links that connect GPUs, switches, servers, and storage systems across modern data center networks.
Litrinium develops high-speed semiconductor components used in optical and copper interconnects, including transimpedance amplifiers (TIAs), laser drivers, equalizers, clock and data recovery devices (CDRs), and retimers.
These technologies enable reliable communication across increasingly complex data channels as bandwidth requirements continue to grow across AI and cloud infrastructure.
AI workloads rely on massive volumes of data moving continuously between processors, memory, and storage. As data rates increase, signals become more susceptible to noise, channel loss, and other physical effects.
Maintaining signal integrity ensures reliable communication across the network, allowing AI systems to operate at full performance without introducing errors, latency, or wasted compute resources.
AI clusters continue to expand in scale, bandwidth, and architectural complexity. Litrinium develops technologies designed to support this growth, enabling scalable connectivity across large GPU clusters and modern data center networks.
Our focus on high-speed signal integrity helps ensure that next-generation infrastructure can scale efficiently as AI workloads continue to grow.
Litrinium is built around deep expertise in high-speed analog and signal integrity engineering. Our team focuses exclusively on solving the connectivity challenges that emerge as data rates and system complexity increase across modern data center infrastructure.
This focus allows us to develop technologies that enable reliable, power-efficient connectivity at the speeds required by next-generation AI systems.
Litrinium works with companies that design and manufacture the connectivity infrastructure used in modern data centers. This includes developers of optical modules, high-speed interconnect solutions, and networking platforms serving AI and hyperscale computing environments.
Data center infrastructure requires technologies that operate continuously at extreme performance levels. Litrinium follows rigorous design, validation, and qualification processes to ensure our products meet the reliability standards required by modern computing infrastructure.
Our solutions are engineered for long-term performance in environments where uptime and data integrity are critical.
Litrinium believes that high-speed connectivity is one of the foundational technologies of the AI era. As computing systems grow in scale and complexity, the demand for efficient, reliable data movement will only increase.
Our mission is to advance the semiconductor technologies that enable the next generation of high-performance computing infrastructure.
